HAL machine hot air leveling machine PCB tin eject machine

HAL machine  hot air leveling machine PCB tin eject machine

range: PCB process, tin coating

specification:

1, Effective Electric Power: 62KW
2, Solder Pot Capacity: 600KG( without Pb)
3, Molten tin bath Temperature:250~280
4, PCB board thickness: 0.8mm~3.0mm
5, PCB max working area: 610mm*610mm
6, Stiring temperature: 250~280
7, air knife temperature: 350~380
8, Air knife pressure: 3kg/Squre cm~6kg/Square cm
9, Machine weight: 1200KG
10Machine Size: 1760(L)*1300(W)*2370(H)

feature:

1, use Taiwan MDF Heater, radiation heating, 80minutes to finish the preparasion of production
2, composite double-life style air knife post, easy to maintain, convenient to adjust air-knife angle and clean
3, movable linear guide, titanium alloy, resist to Tin
4, SMC remote pneumatic pressure regulating valve, SMC snifting valve

HAL parts: